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Latest update： 02/10/2023 11:27:18
NIKKO KOGYO CO., LTD.
We will respond to your needs with our many years of experience and technology in precision metal press processing.
We perform precision metal press processing for semiconductor components, and manufacture and sell precision molds and electronic components. We manufacture and sell plastic lenses that have been jointly developed with major manufacturers for use in vehicles, security, and cell phones. Production of semiconductor lead frames (diodes, image sensors, ICs), and hoop plating, electrolytic plating, and electroless plating processing in cooperation with partner factories are also possible.
Sales Pitch
- Manufacture and sale of precision metal press products
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Press processed products
Materials and plating results Materials: Copper type in general, KOV, 42 alloy, cladding (CKC, CIC, etc.), SpCC, AL Plating: Hoop plating (Ni, Ag, etc.), electrolytic plating (Ni glossy, Ni non-glossy, Sn, Ag, Au, etc.), electroless plating (Ni, etc.) Semiconductor lead frames Product types: Diodes, image sensors, ICs Production capacity: 3000KF/M
Lens products
Our involvement with the lens business began 18 years ago with the manufacture and sale of cameras under our own brand. In recent years, the number of applications for lenses for automobiles, security and mobile phones have increased and we are developing, manufacturing, and selling lenses together with major manufacturers. Proprietary brand products Plastic lenses for mobile phones Lens housing for mobile phones Built-in lenses for mobile phones
Copper base (reverse-side copper plate adhered) substrate
Features of copper base substrate 1. The opening of conventional glass-epoxy substrate was completely open, and direct chip mounting was not possible. However, this board can be directly mounted by attaching a copper plate (t0.2mm) to the back of the opening. 2. The SMD type has electrodes on the back surface, eliminating the need for wiring from the pattern surface. 3. Manufacturable range Thickness of around t0.2 to t0.8mm Copper reverse-side thickness up to Max t0.25mm Capable of supporting up to 6-layer substrates