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Latest update: 15/09/2022 12:22:11


The formation of ultra-fine patterns will lead the next generation.

By applying semiconductor processes (photolithography and dry etching), we form fine patterns in nano or micro nano levels. Furthermore, for mass-production, we are able to form fine patterns, which have conventionally been said to be impossible unless semiconductor processes or nanoimprint is performed, by performing injection molding.  

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Sales Pitch

On a contract basis, we produce products ranging from masters of ultra-fine patterns to mass-produced ultra-fine patterns.
Contract-based microfabrication performed with semiconductor processes 
By applying semiconductor processes (photolithography, dry etching, and so on), we form ultra-fine patterns in nano or micro nano levels on silicon wafers that will be provided to clients. Furthermore, the patterns can be copied through electroforming and used as masters for injection molding or nanoimprint or as devices for evaluation. 
We are able to form various shapes including L/S, pits, and pillars. Furthermore, we are able to form not only 2D shapes, but also 3D (three‐dimensional) shapes by using gray scale exposure. We are able to form patterns on substrates (wafers) the size of which is up to 8 inches.
Mass-production of ultra-fine shapes through injection molding which uses our own technology, HPA-Die🄬
By using metal molds which adopt our own technology, HPA-Die🄬 (Japanese Patent No. 6418619), we achieved the pattern shapes which only semiconductor processes or nanoimprint has conventionally achieved and which are at least 100 nm. For the pattern shapes, we use an injection molding machine. The achievement allows us to mass-produce ultra-fine shape products at low costs.
Thanks to our own metal mold structure, HPA-Die🄬 controls the flow of heat from resin to the metal mold, ensuring high flowability on the outermost surface. The mechanism allows injection molding to achieve ultra-fine transfer.
[Merits of the products]
Compared with the products formed by the dry etching of quartz glass in semiconductor processes or by nanoimprint, HPA-Die🄬 achieves overwhelming price advantage and mass productivity. Various types of general-purpose resins (PC, acrylic, COC, COP, etc.) can be used as materials. Furthermore, the forming cycle is equivalent to that of general molding. Therefore, HPA-Die🄬 achieves high productivity.
[Outline of the service]
Hearing the specifications => Creating a master (original master of a fine pattern) => Producing a metal mold => Trial production and mass-production through injection molding => Providing the molded article
[Applied areas]
Medical-related areas: Biotip
Display area: AR glasses, and HMD (DOE, HOE, Fresnel lenses, and moth-eye plates)
Sensor-related areas: LiDAR, face recognition (DOE), and so on
Metallizing and patterning of thin metallic film
By using sputtering or deposition equipment, we metalize various thin metallic films on silicon wafers. By utilizing fine pattern formation, we are able to create metal film patterns. Furthermore, on a contract basis, we can form thin amorphous carbon (diamond-like carbon) film with superior hardness and abrasion resistance. 




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Kanto Head Office, SMRJ