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Latest update: 15/09/2022 12:22:14

KATOH co.,ltd.

Comprehensive manufacturer that designs, develops, manufactures, and sells semiconductor components, electronic components, and so on

We are a comprehensive manufacturer that performs processes, ranging from development to manufacture, for manufacturing semiconductor components, electronic components, and so on. Without having capital ties with other semiconductor manufacturers, our main business is to independently undertake semiconductor post-processes on a contract basis. We undertake a wide range of processes, including the assembly as well as testing of electronic or optical components and board mounting, on a contract basis. Our manufacturing bases are located in Japan, and manpower is thoroughly eliminated or reduced. Through this, we lower the cost, which is better than that of overseas companies in the same industry, and provide excellent technologies as well as high-quality products.

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Description of business
Services provided by us
In an integrated fashion, we provide services including the design as well as development of packages desired by clients, the evaluation of the packages' reliability, and the mass-production of the packages. 
<Services provided by us>
-Wafer tests/final tests
On a contract basis, we carry out test processes (wafer tests and final tests). We have a total of approx. 100 different testers.
-Semiconductor package mounting and tape automated bonding (TAB) mounting
We provide various types of packages the main of which are small-pin leadless packages.
-Board mounting service
We are equipped with highly reliable technologies and equipment for flexibly meeting clients' needs such as the mounting of bare chip ICs.
-External plating service 
We are equipped with eco-friendly production lines that conform to environmental regulations such as the RoHS directive and that include those for "lead-free plating specifications".
Semiconductor packages
We provide various types of packages the main of which are small-pin leadless packages.
<List of semiconductor packages>
- SON
- QFN
- DIP
- SC
- TO
- SOP
- COB
- SMT
- CeramicPKG
We are also able to develop and manufacture customized packages, such as those of crystal devices and optical components, which meet clients' requirements.
Technologies that we have 
By applying the technologies specified below, we propose line design optimum for clients. 
<List of the technologies that we have>
- Dicing
- Dice bonding (Ag bonder, AuSn bonder, and flip chips)
- Wire bond
- Sealing (mold sealing, cap sealing, potting, under filling, and side filling) 
- Individual pieces
- Inspections (visual or electrical inspections)
- Marking
- Storage
- Screen printing
- Mounters 
- Reflow
- Cleaning

SDG Actions

DECENT WORK AND ECONOMIC GROWTH
INDUSTRY, INNOVATION AND INFRASTRUCTURE
RESPONSIBLE CONSUMPTION AND PRODUCTION
CLIMATE ACTION
LIFE ON LAND
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