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3D-SiP: 3D System in Package

[We support the development of SiPs that apply our patented 3D-PKG technology for the shortest wiring between elements and built-in high-strength external terminals]

With the transition to the 5G era, further technological innovation will be required in the semiconductor industry.

New packaging technologies are attracting attention to keep up with various technological innovations, such as chiplets, where chips are divided by function and process nodes are selected and integrated on a package, and the change from multi-core to heterogeneous multi-core systems for high-speed processing of large amounts of data.

The 3D system-in-package (3D-SiP) technology developed by our company in collaboration with AIST Kyushu and related companies (including Maxell, Logic Research Labs, and Denken) is expected to be adopted in various IoT devices in the medical field, space industry, wearable devices, and so on.

In addition to high-density wiring associated with the 3D integration of semiconductor devices, the technology we have developed has the following characteristics:
(1) The same material is used for both the front and back of the package to ensure high reliability.
(2) Electroplating technology is adopted to strengthen the external electrodes.
(3) SUS substrate peeling is employed to produce thinner substrates.

FOWLP thin all-surface mold packages

[New FOWLP method technology]

This is an ultra-thin fan-out package with a full grid of high-strength external terminals, which is molded all around its circumference with the same resin to achieve high reliability.

In collaboration with AIST Kyushu and related companies (including Maxell, Logic Research Labs, and Denken), our company has developed a new technology for high-density wiring associated with 3D stacking of semiconductor devices.

(1) The same material is used for both the front and back of the package to ensure high reliability.
(2) Electroplating technology is adopted to strengthen the external electrodes.
(3) SUS substrate peeling is employed to produce thinner substrates.

Cavity 3D-SiP (cavity packaging)

[Innovative technology for packaging]

This package provides cavities for mounting MEMS elements and optical sensors, and achieves miniaturization, thinness, and high integration by 3D mounting these elements together with the semiconductor elements that drive them.

The 3D system-in-package (3D-SiP) technology developed by our company in collaboration with AIST Kyushu and related companies (including Maxell, Logic Research Labs, and Denken) provides high-density wiring accompanying the 3D integration of semiconductor devices, and has the following characteristics.

(1) The same material is used for both the front and back of the package to ensure high reliability.
(2) Electroplating technology is adopted to strengthen the external electrodes.
(3) SUS substrate peeling is employed to produce thinner substrates.

Compact LED packages with high heat dissipation

[The industry's top-ranking heat dissipation technology]

In LED lighting, which replaces fluorescent lamps, LED packages are mounted on long printed circuit boards.

The heat from the LEDs is dissipated to the frame through the package electrodes and printed circuit board. This causes the temperature of the LED element to rise due to thermal resistance, resulting in a decrease in luminous efficiency.

The LED packages with high heat dissipation provided by our company are structured to maximize the heat dissipation characteristics of the LED, and also eliminate the need for a printed circuit board.

High-luminance LED fish-luring lighting system

Squid and many fish species have a habit of reacting to blue-green light that reaches underwater.

LED fish-luring lighting is a way to take advantage of this.

LED packaging

[We select substrates and materials for LED packaging and provide solutions for collaboration with contract film production companies]

As a general characteristic of LEDs, luminance decreases as the temperature rises due to the heat generated by the LEDs themselves, and the luminous efficiency of LEDs in Lm/W (lumens per watt) depends on the packaging structure.

Our company proposes packaging structures that achieve maximum efficiency, while selecting base materials, reflective materials, wiring materials, encapsulation materials, and so on that constitute the structure, to provide solutions in cooperation with contract film production companies that can realize this packaging method.

Catalogue/Pamphlet/Proposed

This company is recommended by the following support organizations.

Marketing Support Department, SMRJ