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Latest update： 24/08/2022 12:18:03
We solve all problems related to substrate mounting, such as substrate modification, BGA (ball grid array) replacement, BGA rework, POP (package on package) mounting, BGA reball, and recycling of discontinued parts.
[Description and strengths of our business] Even before the term SDGs was widely recognized, we had already started focusing on the global environment. Through our business including substrate modification, substrate repair, BGA reball, and parts recycling, we are making company-wide efforts to create an environment that is more friendly to the earth. In order to resolve customers' dissatisfaction, we do business while always considering what we can do now. Our Head Office is located in Kyoto City, and for approximately 30 years since our foundation, we have been manufacturing security devices under OEM contracts. We are involved in processes starting with development which includes circuit design and appearance design. In a consistent manner, we continuously perform manufacturing processes, which include metal mold production to parts procurement, on a contract basis. We are able to produce prototype substrates and perform substrate mounting in a short period. The Iwaki Sales Office provides the services specified below, by utilizing the experience and performance nurtured during 25 years of cellular phone repair: BGA replacement, BGA repair, BGA rework, BGA reball, substrate modification, substrate repair, performing soldering in place of clients, and contract-based services for X-ray inspection with CT functions. Our services related to BGA rework, BGA reball, and substrate modification have an especially good reputation among clients thanks to their high quality and short delivery periods.
- Trial production, mounting, and rework
Substrate modification service
We modify specified areas of a substrate or replace substrate parts as soon as possible.
Environment protection, SDGs: Recycling EOL (end of life: production stoppage or discontinuation) parts
We recycle BGA, QFN, modules, QFP, SOP, connectors, various surface-mounted parts, and discrete components. We receive orders for reformulating BGA solder (eutectic solder balls <=> lead-free solder balls). Even before the term SDGs was widely recognized, we had already started focusing on the global environment. Through our business including substrate repair, BGA reball, and parts recycling, we are making company-wide efforts to create an environment that is more friendly to the earth.
Performing soldering in place of your company
We solder parts, ranging from ultra-small chips to large-sized connectors or BGA parts, on substrates. We have multiple experienced staffers who perform manual soldering. They are able to hand-solder chips the size of which is up to 0402. We are good at not only soldering chip parts, but also mounting or reworking QFP as well as QFN with a thermal pad and BGA (up to 2,000 pins). By using IR (infrared rays) equipment, we solder SMD connector parts such as those of Samtec. Therefore, there are no worries about the melting of connector resins. We perform X-ray inspection (inclination angle: up to 60º) on leadless parts after they are mounted. If your company does not have enough man-hours to perform soldering in a specified period, or if a substrate is equipped with both eutectic solder (leaded) parts and lead-free parts, please let us handle the matter. Please feel free to contact us for work that has been refused by other companies.
This company is recommended by the following support organizations.
- Kansai Head Office, SMRJ
INDUSTRY, INNOVATION AND INFRASTRUCTURE