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Latest update: 30/11/2020 15:54:12


High level electroless bonding.

We work with plating printed circuit boards. We specialize in surface treatment process, and handle special substrates and high-multilayer/large-sized substrates. High level electroless bonding is available.

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Sales Pitch

Business items
Surface treatment of circuit boards for electronic devices
• Development of surface treatment process
• Prototype plating for certification and mass production plating
Main equipment
• All necessary bonding plating facilities 
• All necessary surface treatment facilities for high-density semiconductor substrates
• Handling various surface treatment, set of plating facilities for prototype making
• All necessary pure water supply system
•All necessary dryer systems for pure water cleaning
• All necessary fluorescent X-ray membrane thickness measurement equipment
• Complete set of fully automatic all-filtered wastewater treatment system

This company is recommended by the following support organizations.