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Latest update： 30/11/2020 15:54:24

FUJIKOSHI MACHINERY CORP. 

Development of precision silicon wafer polishing equipment.

We work with the development, designing, manufacturing and sale of semiconductor processing equipment, and the technological development of machines and equipment for polishing wafers (substrates) is our core technology.
The technical skills to cut/polish high-tech materials, including silicon, ceramic and sapphire, are not common, but are essential for improving convenience in daily life.
The devices we produce are delivered to both Japanese and overseas customers, and are currently in operation.

Inquiry
Main image

Sales Pitch

Polishing machine 
Double-sided polishing machine
By placing the workpieces at the carrier hole between the upper and lower surface plates and applying various types of fine free abrasive grains using a ring-shaped slurry pan, the processing-deformation layer, created in the process of wrapping processing can be removed, and a smooth surface can be achieved. Furthermore, by applying rotational and orbital motions, flatness and level thickness can be achieved for the workpiece at the carrier hole.
Single-sided polishing machine
By placing workpieces attached to disk-shaped blocks, which are made of ceramic and/or glass, on the surface plate, and applying various types of fine free abrasive grains, processing-deformation layers created in the process of wrapping processing can be removed and a smooth surface can be obtained. The surface plate is covered with artificial leather (for polishing).
Single-wafer single-sided polishing machine
Finish polishing is conducted using various fixing methods, for instance where various workpieces are held or attached individually to disk-shaped blocks. We also handle automation of cassette to cassette.
Wrapping machine 
Double-sided wrapping machine
By placing workpieces at the carrier hole between the upper and lower surface plates and applying various types of fine free abrasive grains using a ring-shaped slurry pan, the wrapping processing can be performed to ensure level thickness. By applying rotational and orbital motions, flatness and level thickness can be obtained for the workpiece at the carrier hole.
Single-sided wrapping machine
By placing workpieces attached to disk-shaped blocks, which are made of ceramic or glass, on the surface plate, and applying various types of free abrasive grains, the wrapping can be performed to ensure level thickness. Cast iron, copper, and brass are used for surface plates, and fine particles of diamond are also used often for sapphire and SiC.
Loading/unloading
With one-side polishing machines, we use multiple number of these machines for improving the polishing in steps. It is used widely in many sites as a means to transport disk-shaped blocks safely and appropriately at both input and output sides as well as between devices.

This company is recommended by the following support organizations.

Kanto Head Office, SMRJ
Inquiry

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