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Manufacturing of semiconductor manufacturing machines

We manufacture and sell treatment devices for the photo lithography process (coating, exposure, and development) in the semiconductor manufacturing process. With our focus on silicon semiconductors, compound semiconductors, and micromachines, we accommodate amorphous substrates with diameters of 2–8 inches for setting. All the equipment can be adjusted easily by inches. ASAP handles everything in-house from design to manufacturing. We provide equipment with optimal specifications, such as low pricing and compact design, by utilizing flexible customization. 

Overview of products and technologies

We mainly manufacture coaters/developers, lift-off devices, and mask aligners. For coaters/developers, we managed to create a compact casing in the size that matches the wafers by applying resist, polyimide, and dopant in fully automatic C-to-C coating/baking. Our lift-off devices has a compact body with no DIP tank, suggesting that there is no need for fully sheet-fed spin processing with no reattaching, or swelling treatment, which enables quick processing. A mask aligner is a C-to-C automatic batch equal magnification exposure mask alignment device. Gap management is performed in a completely contact-free manner.

Message from the representative

Semiconductors have become essential to life. With 5G communication being launched, we hope to expand sales to semiconductor manufacturers and electronic parts manufacturers that contribute to autonomous driving technologies as we expect their sales to increase as the performance of autonomous driving systems advance further. We engage in activities to incorporate demands from customers not only in Japan, but in the US and China, where semiconductor production is booming. In the US, we donated equipment to the UC Berkeley for demonstration, which led new orders not only from the University but also from nearby companies who use these equipment for development purposes.