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Latest update： 22/01/2020 10:12:45
Takara Seisakusho Co., Ltd.
Sales Pitch
- TKR's original high-volume automatic molding device
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The greatest characteristic of our device is that our original special sealing mehanism achieves high vacuum in transfer molds. It reaches a level lower than 20 Pa (0.15 Torr) within about 2.5 seconds.
This device performs high-volume molding on power modules, IGBTs, and other products equipped with multiple parts inside a single package. In so doing, the device is highly effective in eliminating voids and cavities. All this improves quality and yield as well.
Semiconductor products that mold complex-shaped products and different materials simultaneously, along with IGBTs, IPMs, SIPs, LEDs, and other semiconductor products.
Other presentation
[Company strength] Our company excels at making 100-ton class precision dies (with a functional section of ±0.003 mm or less). Our handling of proximity sensors, image sensors, photo-couplers, and reflectors is highly valued by our customers. We make recommendations on the product shape during die production by considering all the elements from prototype making to mass production. We can also suggest optimal dies for individual customers in terms of ease of use, cost, and delivery. This is based on the material, surface treatment, and other conditions associated with the die. [Business description] We manufacture and sell precision dies. Our company mostly manufactures dies (thermosetting resin), press dies, injection dies, insert dies, and automatic production units for semiconductors. Our dies are designed and manufactured, heat-treated, assembled and adjusted, and produced (prototypes and mass production) entirely in-house. We particularly excel at making dies for LED products (clear resin) and power devices, and we offer our extensive technologies to product developers as an experienced die manufacturer. [Industry] Precision die manufacturing [Representative's message] Our company offers one-stop solutions related to dies for proximity sensors, SIP, and semiconductors. This includes the entire production system as a packaged solution as well as design, development, and production services. We can also handle press dies and mold dies for prototype making and mass production, and recommend the most efficient device particularly in terms of reducing material cost. We work with the R&D sector and public development institutions, and make use of our experience in solving various problems for our customers during product launches. Please consider using our service in various situations you are in. [Company structure for market development/overseas expansion] Our current focus is on cultivating overseas markets. We will provide the die and system technologies we have gained in the Japanese semiconductor market to semiconductor manufacturers in Taiwan, China, and Korea through trading companies. We have a technological partnership with the Taiwanese semiconductor research institution ITRI, which helps us catch up with the latest overseas needs in daily R&D activities. This arrangement enables us to bring back the latest technologies to the domestic Japanese market, allowing us to help customers with product launches. [Awards and media coverage] Mizuho Global News, “Waza: Representative Japanese Companies” (No. 61, 2016). [Authorization/Certification] ISO 14001 ISO 9001:2008 [Intellectual property] Intellectual property asset registration numbers: 3604878, 3604963, 4497766, 4077185, and three others in Japan; TW I343082 in Taiwan.
This company is recommended by the following support organizations.
- Kanto Head Office, SMRJ
