Corporate
Profile

[Company strength]
Our air punchers are characterized by their high precision achieved with a less-than-5 μm clearance and a sharp edge producing no burrs, and which are compact, low cost, and safe. They are free from vertical oscillation of TAB tapes during punching. When punching rubber components, our technology to optimally control the pressure at the cutting edge of a die helps inhibit the generation of burrs, which were conventionally hard to eliminate even by washing. We have also developed a technology that enables precision punching in acrylic resin sheets that defied punching by conventional precision punching method. This technology is most suitably applied to production of display parts for mobile devices.


[Business description]
We manufacture and market air punchers for film processing (TAB tape, bag-making, etc.), press dies for processing aluminum sashes, and dies for processing various panels used in aluminum truck vans. Our business activities also include development, design and prototype production assistance for special dies and automated units. Continuous punching of holes in ultrathin films, aluminum foils, and paper at high speed rarely seen until recently because dies would become dull quickly and burrs were difficult to get rid of. We have overcome these problems. Our dies ensure high-precision, high-durability, and high-speed punching operations.


[Industry]
Air puncher manufacturing and film processing


[Representative's message]
Precision air punchers for punching ultrathin sheets are the core business of our company. We are also proud of our technology for punching holes in non-plated copper frame protective films. If you have any problem or question about air punchers or film processing, please feel free to get in touch with us. We will be very happy to be of service to you. We will continue striving for the development of new technology and new products that will be competitive in terms of cost and quality.


[Company structure for market development/overseas expansion]
We have succeeded in the research and development of a technology for punching holes in a non-plated copper frame protective film of an IC chip. Specifically, this technology enables only an adhesive part to be peeled from the non-plated copper frame protective film without affecting the Cu substrate, and therefore is expected to greatly modernize the semiconductor production process.


[Awards and media coverage]
[Awards]
The 34th Best Kawasaki Entrepreneur Award at Kawasaki Entrepreneur Audition.


[Intellectual property]
“Synthetic resin working device and method” (registration No. JP 3859644 B, and international patent publication No. WO 2007/000803 A1); a patent application for this invention was also filed in Korea, and a patent has been granted.