Corporate
Profile

[Company strength]
We create new value by combining plastics with other materials. We can produce electronic parts of various shapes by integrating resin with metal. We own many large molding machines, and our staff in the technical division help customers who want to modularize parts. We help produce new functional parts.

[Business description]
We are mainly involved in injection molding, particularly insert molding to integrate plastic with metal. We manufacture and sell power semiconductor cases, automotive ECU cases, connectors, etc., and mechanism parts. We deliver products to customers in a broad range of industries including the industrial, semiconductor, and automotive industries, and respond to the needs of these customers.

[Industry]
Electrical equipment part and electronic part manufacturing

[Representative's message]
We have celebrated 43 years since the company’s foundation. We have cultivated our technical skills and ability to make proposals through our experience of doing business with many customers. We are proud of our contributions to modularizing electronic parts by using complex, integrated resin. We will continue to improve QCD for electrical machinery and appliances and automotive related parts. We are also determined to contribute to innovation for customers by combining our strengths with those in all industries that need to solve the issues of parts assembly.

[Company structure for market development/overseas expansion]
Our technical division in the sales department enables us to discuss needs and issues with customers on site. We are adding staff in the design division, who draft drawings for customers and propose drawings jointly with customers. We intend to hire more staff who can offer technical proposals in both Japan and Indonesia so that we can respond to customer needs in Japan and abroad. We are keen to work with customers to create new functional parts.

[Authorization/Certification]
ISO 9001; ISO 14001

[Intellectual property]
Japanese Laid-Open Patent Application No. H08-039605 “Three-dimensional insert molding of wiring board”; Japanese Laid-Open Patent Application No. 2002-325549 “Electromagnetic wave shield box and its manufacturing method”