Corporate
Profile

[Company strength]
We believe that maintaining high quality is the most important point in manufacturing electronic parts. We have built up a quality management system defining quality policies and objectives. We are continuing to review the appropriateness of this system with internal audits to improve our management system. We have made a series of investments in equipment, and installed a 5000/cf cleanroom in about the 636-square-meter class in an electrostatic factory under temperature and humidity control. We have installed a semiconductor post-processing line, an automatic surface mounting line, and an LED chip test line. We also focus on cultivating human resources.

[Business description]
We aim to be a company that is capable of contributing to society by manufacturing electronic parts and equipment. Our corporate philosophy is to be a group of good, full-fledged members of society. Our company was established in 1982. We manufacture a broad range of electronic parts for a major semiconductor manufacturer and manufacturers of electronic parts and electronic equipment as their partner. We have been engaged in semiconductor device post-processing, mobile phone assembly, and high-density, double-sided part packaging on printed circuit boards. We also apply the semiconductor manufacturing technology we have been cultivating for many years to perform LED chip probe testing and sorting.

[Industry]
Semiconductor, crystal, and LED device inspection

[Strength of products/technologies]
We have accumulated semiconductor manufacturing technologies and know-how regarding product manufacturing management. We achieved this by manufacturing ICs in post-processing for Hitachi semiconductor products for 16 years and Kyocera mobile phones for nine years. Our company has been continuously improving its quality management system and satisfying various customer requests with advanced production technology and high quality. Our main technology is aluminum stud bump bonding. We are one of a few companies that possess a wide range of devices, and we have unrivaled technology for forming ultra-small bumps on wafers or IC chips.



[Representative's message]
Our company increased its customer base twofold in both 2014 and 2015 under our project to increase transactions with major companies in Japan. Our machining technology is highly technical, so business matching is at an impasse and requires a long time. There are still many needs for our company, so we will work to further improve our technical power to be a company that makes the world better by contributing to society. We will remain devoted to cultivating sales channels by disseminating our exclusive machining technology through J-GoodTech.

[Company structure for market development/overseas expansion]
Our general affairs section supports customers as our point of contact. Our technical staff (five engineers) provide technical consulting and directly visit customers as required.



[Awards and media coverage]
[Awards]
Hokkaido Labour Bureau (Safety and Health), Director General’s Encouragement Award.

[Media]
100 Selection of Hokkaido Companies of Fundamental Technologies Supporting Manufacturing selection by the Department of Economic Affairs, Hokkaido Government.


[Authorization/Certification]
Acquired ISO 14001 certification in May 2005, and ISO 9001 certification in March 2006.

[Main Clients / Business History (domestic)]
Nihon Dempa Kogyo Co., Ltd., Hitachi Limited, Toshiba Hokuto Electronics Corporation, New Japan Radio Co., Ltd., Tower Jazz Panasonic Semiconductor Co., Ltd., Fukushima Sanken Co., Ltd., Kaga Toshiba Electronics Corporation, and so on.