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Latest update： 26/02/2020 10:25:10
FJ Conposite Material Co., Ltd.
We possess high technology for bonding different kinds of materials, such as metals and ceramics.
We are an R&D startup that develops and manufactures heat sinks for radio-frequency semiconductors, DBC boards for power semiconductors, heat dissipating materials for vertical LEDs, and fuel cell separators. Our diffusion bonding technology using a hot press is a globally unique technology based on more than 20 years of experience. It is capable of bonding different kinds of materials, such as metals, ceramics, and carbon. We have experience in joint R&D with AIST’s Advanced Power Electronics Research Center and in development on consignment from many major companies in Japan and abroad.
- Our company provides parts and technology for supporting next-generation industries
Our company possesses a globally unique technology for freely joining different kinds of materials.
Our company possesses a globally unique technology for freely joining different kinds of materials (metal, ceramics, and carbon) by diffusion joining with a hot press.
Our company manufactures materials having both conductivity and corrosion resistance
We make use of carbon fiber, carbon powder, and resin composition technology to manufacture materials having both conductivity and corrosion resistance, such as fuel battery separators.
We handle parts and technology from development to mass production
Our company develops and mass-produces products such as semiconductor heat dissipation material (S-CMC), insulation boards for power semiconductors (DBC), vertical LED heat dissipation material (CMC), and fuel cell separators. We provide parts and technology to support next-generation industries. We manufacture even single prototype products.
[Company strength] Our company possesses a globally unique technology for bonding different kinds of materials (metals, ceramics, and carbon) by means of diffusion bonding with a hot press. We manufacture fuel cell separators and other materials, both conductive and corrosion-resistant, by making use of our technology for compounding carbon fibers and carbon powder with resin. This is possible for us because of our manufacturing, machining, and measuring devices. We possess hot presses and sputtering devices for manufacturing, NC milling machines and sputtering devices for machining, and ultrasonic flaw detectors, 3D microscopes and thermal expansion measuring machines for measurement. [Business description] Our company provides services from development to manufacturing. We handle products including semiconductor heat dissipation materials (S-CMC), power semiconductor insulation boards (DBC), vertical LED heat dissipating materials (CMC), and fuel cell separators. We supply parts and technologies to support next-generation industries. We experimentally create even single articles. [Industry] Composite material development and manufacturing [Strength of products/technologies] Our S-CMC is a heat-dissipating material with a coefficient of thermal expansion matching that of ceramics. This material has heat dissipation performance that is a few times greater compared with conventional materials. We have filed 58 patent applications (acquired 24 patents) and presented 72 papers (including oral presentations). We are developing technologies based on these achievements. Our company has a network linking many companies and we handle cases with partner companies if they are difficult for us to handle alone. We will make a proposal based on our past experience and achievements when you tell us your request. [Representative's message] We are an independent startup established in 2002, and we have been engaged in processing from development to mass production. Our diffusion bonding technology using a hot press is a globally unique technology based on more than 20 years of experience. It is capable of bonding different kinds of materials, such as metals, ceramics, and carbon. Consult us about the bonding and development of materials that have been considered difficult to handle. This includes materials for heat sinks for radio-frequency semiconductors, DBC boards for power semiconductors, heat dissipating materials for vertical LEDs, and fuel cell separators. [Company structure for market development/overseas expansion] Our president directly responds to customer inquiries. We also provide support for customers through several trading firms in Japan and abroad (USA, Taiwan, Korea, and so on). [Market share/Ranking] We manufacture various products by making use of unique technology. [Awards and media coverage] [Awards] The 26th Excellent New Technologies and Products Award, Excellence Prize; Chubu Science and Technology Center, Promotion Award (2014). [Media] Monthly Material Stage, "Thermal Radiation from LED Equipment by Using Copper-Molybdenum Composite Materials" (September 2010); Monthly Display, "Heat Dissipation from LED Elements by Using Copper-Molybdenum Composite Materials" (August 2012). [Joint research and development] Clad Material and Manufacturing Method (Japanese Patent No. 3862737); Fuel Cell Separator Manufacturing Method (Japanese Patent No. 3715642); 20 other patents in Japan (58 patent applications) and 7 patents overseas. [Main Clients / Business History (domestic)] Kyocera, Toyota, Honda, Nissan, Denso, Aisin, Keihin, Mitsubishi Electric, Fuji Electric, Sumitomo Electric Industries, Nippon Steel, UACJ, Nichia, Toyoda Gosei, and many others. [Main Clients / Business History (overseas)] KAI (USA), KOSTECSYS (Korea), TRANSCOM (Taiwan), Tonghui (China), and many others.
This company is recommended by the following support organizations.
- Hokkaido Head Office, SMRJ