Corporate
Profile

[Company strength]
Our company was founded in 1987 as the first company in Japan to develop IC decapsulation equipment using nitric acid and sulfuric acid. (At the time workers manually conducted dissolution decapsulation of resin using dangerous strong acid.) We have continued to develop decapsulation equipment corresponding to ICs and testing equipment, which are rapidly increasing in their degree of integration and diversification. Our product lineup is now second to none in the world. It includes dry etching equipment, back polishing equipment, and decapsulation equipment.

[Business description]
We develop, manufacture, and sell semiconductor decapsulation and test equipment, and offer consignment decapsulation services.

[Industry]
Electric equipment

[Strength of products/technologies]
When an IC (integrated circuit with semiconductor and wiring) breaks down, to identify the cause it becomes necessary to dissolve and remove the resin package with acid. Processing such as chip grinding is then applied, and the failed part is put into an observable condition. Our company has developed equipment according to each IC decapsulation process since our foundation in 1987. We have prepared a lineup including test equipment and consignment decapsulation services. Today our equipment is widely used by customers around the world. The decapsulation technology we cultivated through our EDLab consignment decapsulation service has also received high evaluations.

[Representative's message]
Failure analysis is a crucial process in the quality management division of an IC manufacturer. We have engaged in continuous development in order to contribute to improving the yield rate in order to share such an important responsibility. Reliability testing for new materials, package miniaturization, enlargement, and so on, has to be conducted as long as ICs change. We hope to continue to take on the challenge of stably providing the extremely thorough services required for actual analysis work.

[Company structure for market development/overseas expansion]
Our main customers are the major semiconductor manufacturers. We have established a system for decapsulation after equipment delivery and service support. We hope to find solutions to problems in cooperation with our customers. We established domestic and overseas sales departments in our HQ, and also sales and service divisions in our Singapore affiliate. We have agencies in Asia, Europe, the United States, Russia, and Israel, and have established a global support organization using these agencies. Our HQ will offer direct support when a customer faces a problem that an agency cannot deal with. We support global customers in failure analysis. 

[Market share/Ranking]
Chemical decapsulation equipment: 80% share of the domestic Japanese market and 40% share of the global market.
Laser decapsulation equipment: 80% share of the domestic Japanese market and 40% share of the global market. 


[Awards and media coverage]
[Award]
Itabashi Grand Prize of Products & Technology, Award of Excellence, “IC plastic mold decapsulation equipment” (2007). 

[Media]
“Argus 21,” series on “On-Site Reports from Brilliant Companies” (December issue).


[Joint research and development]
National Institute of Advanced Industrial Science and Technology, “IC decapsulation technology using laser injection.”

[Other sites]
Singapore

[Transaction form]
Sales of equipment and consignment IC decapsulation.

[Main Clients / Business History (domestic)]
Sony, Toshiba, Panasonic, Hamamatsu Photonics, Mitsubishi Electric, other major semiconductor manufacturers and many semiconductor users. 

[Main Clients / Business History (overseas)]
Amkor Technology, Fairchild Semiconductors, NXP Semiconductors, Samsung Electronics, other major semiconductor manufacturers, and many semiconductor users.

[Exhibition History/Information]
SEMICON Japan 2012; INTERNEPCON Japan 2013; IC Packaging Technology EXPO; Small and Medium Enterprises Fair 2014 (planned); INTERNEPCON Japan 2014 (planned).