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Latest update: 06/12/2016 14:33:21


3D IC & MEMS structure with chip level ~ 8/12inch wafer level processing

We offer TSV and micro bump bonding technology that deals with mass production.  A staff member versed in medical image processing technologies is in the United States, who is in charge of expansion into US and European markets.

Main image

Other presentation

[Company strength]
Our representative director and CTO have been involved in LSI process development for over 30 years.  The CTO, in particular, is a pioneer in the development of three-dimensional LSIs.  With his deep knowledge about the strengths and weaknesses of the technology, we can provide customers with expert advice and adaptable development proposals.  We have a staff member stationed in the United States who specializes in medical image processing.  This member also has expertise in marketing, good connections within the medical field in the US, and is approaching medical institutions there.  Residing in Silicon Valley, this member has long experience in US business negotiations and is well aware of how to manage and minimize business risks.

[Business description]
A venture enterprise originated at Tohoku University.  We accept orders for three-dimensional stacked LSIs, as well as R&D and small lot production of Si interposers.  For businesses we provides support in (i) TEG design process, reliability evaluation, prototyping, and testing; (ii) 3D IC feasibility studies, prototyping, and small lot production; (iii) silicon interposer design and small lot production.  For research institutions we provide support for (i) prototyping 3D IC chips, (ii) functional evaluations of 3D conversions, and (iii) provision of partially processed samples for research purposes.

Semiconductor manufacturing

[Strength of products/technologies]
We have engaged in development of leading edge elemental and integration technologies for a long period.  We are capable of offering proposals on TSV and micro bump connection technologies that can withstand mass production.  We have also developed a unique technology with Tohoku University for high-speed lamination of base chips of different types of materials and sizes, which enables low-cost production of 3D SoC (System on Chip) components.

[Representative's message]
We focus on laminated three-dimensional LSI (3D-IC) device technology using micro through wiring ? a technology that has leapt ahead of traditional LSI trends. Based on our know-how in design and manufacturing of LSI devices and processes, we deliver 3D LSI prototype samples that are optimized for each customer and offer fabrication method proposals.  We have our research and development base in Sendai, and engage in business with firms both in Japan and overseas, responding flexibly to everything from pre-prototype consultation to joint research prototyping and delivery.

[Company structure for market development/overseas expansion]
Our representative director leads the team of three key members, the CTO, who has worked for major firms, a marketing staff member who handles domestic contracts, and  another who is located in San Jose.  With these in the center, we are dealing with major firms and overseas expansion.  The representative director handles new clients, while the CTO deals with highly-level questions about technological aspects.  This flexible organizational structure has enabled us to respond to all the inquiries we receive.

Strategic Core Technology Advancement Program

[Joint research and development]
Tohoku University: (i) development of non-directional neuro probe 2010 ? 2012 (ii) research and development into manufacturing of micro 3D LSI chip 2011 ? 2013 (iii) research and development of flexible interposer 2012 ? 2013; (iv) Tohoku 3D innovation base: 2012; High Energy Accelerator Research Organization: development of SOI laminated particle detector 2011 - present

[Other sites]
Head Office: 6-6-40 Aza-Aoba, Suite 203, Aramaki, Aoba-ku, Sendai, Miyagi Prefecture; US Office: 135 Rio Robles East # 160, San Jose, CA 95134

[Transaction form]
Prototype development, OEM agreements, joint development, contract processing, product and material sales, and the like

[Main Clients / Business History (domestic)]
With electrical equipment manufacturers, (i) We have received orders for interposers with new structure and we are currently working on prototypes. (ii) Joint development agreements have been executed and projects are ongoing.  We also have business with a medical device manufacturer (for MEMS sensors), a research institution (TEG device design and prototyping delivery completed), electronic equipment manufacturers (multiple orders for prototyping deliveries partially completed), and a materials manufacturer (sample for research delivery completed).

[Main Clients / Business History (overseas)]
 UK research institution (contract processing 2010 ? present); Italian national research agency (contract three-dimensional processing 2012 ? present); US neuro probe manufacturer (contract OEM Si probe production 2011 ? present); South Korean research institution (contract processing delivery completed)

[Exhibition History/Information]
Society for Neuroscience 2011 2012; Inter-NEPCON 2013 Small and Medium Enterprise Fair 2013 SEMICON Japan 2013 3-D Architecture for Semiconductor Integration & Packaging USA 2013 Inter-NEPCON 2014

This company is recommended by the following support organizations.

Tohoku Head Office, SMRJ

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