Latest update： 06/12/2016 14:33:04
Arena Co., Ltd.
Manufacturing of high-precision electronic components with high-density mountings of less than 0.1mm clearance
We particularly focus on development of cutting-edge SMT technologies, including nanochip and narrow adjacency high-density mountings. Our Sales Promotion Section in charge of business expansion, and Technology Sales Section that offers technological consultation, are working together to resolve problems.
[Product description] We are capable of mounting component chips as small as 0.4mm x 0.2mm, currently the world's smallest, on microchip mounting surfaces. We have also achieved the world’s best performance in high-density mounting technology, with ultra narrow adjacency mounting of as little as 0.08mm. The photo shows our highly precise and high speed mounting head that is fine-tuned for high-density mounting, which is what makes these technologies possible. Furthermore, we are promoting the development of narrow adjacency mounting for substrate integrated circuits, along with WLP-LSI chip mounting technology. [Market share/Ranking] Production scale: parts mounting capability of 200 million chips per month [Authorization/Certification] Acquired ISO 9001 quality management certification in July 2004 and selected in the Strategic Core Technology Advancement Program in 2012