Corporate
Profile

[Company strength]
In the field of high-density SMT mounting, we achieved, in anticipation of customer needs, the most advanced mass-production mounting of 0.6mm x 0.3mm microchips in 1997.  This also made possible adjacent clearances of only 0.1mm for super high-density mounting.  In addition, we strive to fulfill vehicular product quality standards and meet our customers' requirements, leveraging our full-scale in-house automation equipment and giving high priorities on both quality and safety.

[Business description]
We manufacture and supply high-precision electronic components based on high-density SMT (Surface Mounting Technology). Our technology has been applied to a variety of communication devices, including cell phones and video signal processing modules for digital TV broadcasting, contributing to the evolution of next-generation technologies.

[Industry]
Electronic Equipment Design & Manufacturing Services (EMS)

[Strength of products/technologies]
We are capable of mounting component chips as small as 0.4mm x 0.2mm, currently the world's smallest, on microchip mounting surfaces.  We have achieved the world's best performance in high-density mounting technology, with ultra narrow adjacency mounting of as little as 0.08mm. Furthermore, we are promoting the development of narrow adjacency mounting for substrate integrated circuits, along with WLP-LSI chip mounting technology.

[Representative's message]
Our company began operations in 1970, engaged mainly in contract manufacturing and assembly of electronic components for TVs and VCRs.  Seizing a business opportunity in conjunction with the succession of a new President in 2003, we decided to break away from 100% subcontracting and launched a new business utilizing our exclusive SMT (Surface Mounting Technology).  However orders fell sharply in 2011, largely due to the great earthquake/tsunami disaster and harmful rumors of accidents at the TEPCO nuclear power plant.  Despite such adversity, we are moving forward with a strong will to contribute to the reconstruction of regional industry and expand our business and sales channel through the development of cutting-edge technology, while sticking with our proven SMT.

[Company structure for market development/overseas expansion]
Our Sales Promotion Section within the manufacturing department is the gateway to business expansion.  The Technology Sales Section is positioned to provide technological consulting, depending on needs.  The Sections work in tandem in problem-solving, including on-site consultation. Our President takes the lead to make quicker decision making possible, particularly in situations where political decisions can be required, such as responding to new clients.

[Awards and media coverage]
Selected for the 300 of Japan's Vibrant Monozukuri (Manufacturing) SMEs in 2006

[Authorization/Certification]
Acquired ISO 9001quality management certification in July 2004 and selected for the Strategic Core Technology Advancement Program in 2012

[Joint research and development]
Fukushima Prefecture Small Business Association (AIST, Meiko, Sony Japan, Clover Electronics; the Strategic Core Technology Advancement Program through the establishment of narrow adjacency parts mounting technology for substrate integrated circuits and WLP-LSI chip mounting technology (2012))

[Transaction form]
Orders for prototype development, OEM contract, joint development and consignment processing

[Transaction terms]
Cut-off date at month-end for payment at the end of the following month

[Main Clients / Business History (domestic)]
Alps Electric Co., Ltd. (consignment processing from 1970 to present) and others

[Exhibition History/Information]
Internepcom Japan 2012 & 2013, International Industrial Fair 2012 & 2013, Medical Creation Fukushima 2012 & 2013, and exhibition and sales meeting for new technologies and methods in the six Tohoku prefectures 2013