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Latest update： 27/04/2017 14:32:59
Nano Ryushi Laboratory Co., Ltd.
Pastes containing silver nanoparticles having high heat resistance and joining strength
We mainly conduct research and development on organic-coated silver nanoparticles and pastes containing silver nanoparticles. Our main business is the manufacture of joining agents from pastes containing silver nanoparticles. These pastes contain no sulfur or nitrogen which are considered unsuitable for semiconductor junctions. The pastes have excellent heat resistance and high joining strength, thermal conductivity, and electrical conductivity. Joining is possible even at 300ºC or lower temperature. Press sintering can complete joining in one to three minutes. The pastes are expected to be widely applicable to the joining of semiconductors using SiC elements and also thermoelectric conversion elements. They are already used for LEDs and under consideration for joining power modules and thermoelectric conversion elements.
[Company strength] We have a patent for the wet reduction of silver carbonate with alcohol, and use this patent to manufacture organic-coated silver nanoparticles. Our pastes containing silver nanoparticles contain no sulfur or nitrogen which are considered unsuitable for semiconductor junctions. Since the pastes are manufactured by using unique technology, they have joining characteristics of unrivaled performance. For example, the pastes allow direct joining to copper, a general substrate material, at 300ºC or lower temperature. In addition, the joining strength is as high as 70 MPa or more. Such pastes can be manufactured at the rate of 100 kg per month. [Business description] We mainly conduct research and development on organic-coated silver nanoparticles and pastes containing silver nanoparticles. Our main business is the manufacture of joining agents from pastes containing silver nanoparticles. These products and technologies are essential for joining the elements of next-generation power modules. Our pastes containing silver nanoparticles have not only excellent heat resistance but also high joining strength, thermal conductivity, and electrical conductivity. Our joining technology and agents are expected to be widely applicable to semiconductors using SiC elements and also thermoelectric conversion elements. [Industry] Chemical industry [Strength of products/technologies] Our pastes containing organic-coated silver nanoparticles allow joining at 300ºC or lower temperature. In addition, press sintering can complete joining in one to three minutes. Since joining changes a layer to almost silver, the melting point becomes about 960ºC, increasing the heat resistance. In addition, the joined layer maintains the characteristic high thermal conductivity and electrical conductivity of silver. Joining using the pastes enables the development of smaller power conditioners with less energy conversion loss. [Representative's message] Since its establishment, our company has focused on research & development, mass production, and marketing of organic-coated silver nanoparticles and pastes containing them. These pastes will contribute to the next generation of power modules and products with high added value as outstanding functional joining agents. We will continue to develop and provide high-quality products by further technical development. [Company structure for market development/overseas expansion] In Japan, we answer customer inquiries and requests. Eight sales staff from the parent company and the top management help with customer acquisition and sales promotion, including technical presentations by the president himself. Outside Japan, we acquire new customers and meet requests from customer companies with the support of local sales staff from the parent company. If sophisticated technical expertise is necessary, our president and the Director of the R&D Center from the parent company visit the customer with local sales staff. [Market share/Ranking] Manufacturer ranking top in the industry for joining characteristics and mass-produced products [Awards and media coverage] [Awards] Osaka Prefecture: Osaka Monozukuri Award 2014 (2014) [Media] Newspapers: Dempa Shimbun (dated December 2, 2013), The Chemical Daily (dated December 3, 2013), Nikkan Kogyo Shimbun (dated December 12, 2013), and Semiconductor Industry News (December 18, 2013) [Authorization/Certification] Ministry of Economy, Trade and Industry - Strategic Core Technology Advancement Program (2015) [Joint research and development] Joint development with Osaka City University (Strategic Core Technology Advancement Program) [Intellectual property] Composite silver nanoparticles (Registration No. 4680313) Composite silver nanopaste (Registration No. 5256281) Composite nano-metal paste containing copper filler (Registration No. 5398935) and three more [Main Clients / Business History (overseas)] Taiwanese LED manufacturer (from October 2015 to date)
This company is recommended by the following support organizations.
- Kansai Head Office, SMRJ