Corporate
Profile

[Company strength]
We have built a system for quick deliveries by establishing two bases (our HQ plant in Tokyo and Aomori plant in Aomori Prefecture), and by handling physical distribution. We have established a system covering from mass production to high-mix low-volume production. We have installed cleanroom environments and water demineralizing equipment at both our plants. We have also installed dicing, back grinding, and charge machine equipment, and provide detailed support for individual customer requests.

[Business description]
We mainly conduct consignment micro precision production of various materials (glass, FPC, ceramic and resin), including semiconductor wafers (silicon material). We handle consignment production of work steps in semiconductor manufacturing post-processing, including dicing, back grinding, reverse-side laser processing, chip tray transfer, and appearance inspection. Recently we have also been taking on high-mix low-volume production and receiving orders for small lot processing such as prototypes, and processing various materials.

[Industry]
Micro precision processing product consignment production

[Strength of products/technologies]
Special dedicated processing equipment and processing technology are required in this field. We conduct processing that matches each material. This is done by making use of our 52 years of performance in micro precision processing and the relevant know-how and technology.
We have arranged a flexible production system to provide quick support from mass production to high-mix low-volume production.


[Representative's message]
We have been exhibiting at INTERNEPCON Japan (Semiconductor Package Fair) for the past five years in a row in order to construct a sales network and acquire new customers. We recently shifted from conventional mass production of semiconductor wafers to high-mix low-volume production (including support for trial manufacturing) and a management structure for a larger number of customers. We hope to further refine our technology strength and expand our business so we can also handle processing various raw materials.

[Company structure for market development/overseas expansion]
We have assigned three staff members in charge of support for new customers. They deliver our e-mail magazine, manage our website, and respond to inquiries from new customers. Our engineers handle customer visits and specifications meeting as sales engineers in close cooperation with our sales staff.



[Market share/Ranking]
We have a top-level ranking because we handle special, rare processing technology for which there is little competition in the market.



[Awards and media coverage]
[Awards]
Our plant in Aomori Prefecture received Excellent Greening Factory approval (Bureau of Economy, Trade and Industry Director General’s Award, 1999).

[Media]



[Authorization/Certification]
Acquired ISO 9001 and ISO 14001 certification. 

[Main Clients / Business History (domestic)]
We have a track record of production and deliveries of semiconductor wafer dicing, back grinding, chip tray transfer, and so on (Hitachi/Renesas, NEC, Casio, and Panasonic) as well as glass dicing processing (AGC/Asahi Glass, and so on). We have extensive experience in trial manufacturing for university laboratories and trading companies.