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Latest update: 27/04/2017 14:25:40

Sayo Seisakusho Co., Ltd.

Solutions for optoelectronics

We help solve problems from the stage of conceptualizing the trial manufacture, development and production of semiconductors, to the respective stages of trial manufacture, production, termination and resumption. Our services include: assembly processing from bare chips for LEDs, LDs, microwaves, Hall elements, MEMS-related modules and LED-related parts; and development support for LED-related materials (such as LED chips, junction materials, lead frames, substrates, and sealing resins). We have experience in trial manufacturing and mass production start-up, acquired by trial-manufacturing small quantities for the laboratories of major electronic manufacturers, mainly in the optoelectronics industry. We leverage our experience of working with more than 5,000 trial manufacturing projects including projects for the development of LED illumination, sensors and materials.

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Other presentation

[Company strength]
(1) Experience in trial manufacturing and mass production start-up, acquired by trial manufacturing small quantities for the laboratories of major electronic manufacturers, mainly in the optoelectronics industry
(2) Production know-how and experience in solving problems for LEDs, LDs, microwaves, Hall elements, MEMS-related modules, etc.
(3) Involved in more than 5,000 trial manufacturing projects including for the development of LEDs, sensors, materials, etc.
(4) Self-procurement of materials (including overseas materials) necessary for development, sample manufacturing for development evaluation, and ability to propose measurement methods


[Business description]
Problem-solving support service from the stage of conceptualizing the trial manufacture, development and production of semiconductors, to the respective stages of trial manufacturing, production, termination and resumption.
Our main targets are:
(1) Assembly processing from bare chips for LEDs, LDs, microwave, Hall elements, MEMS-related modules, LED-related parts
(2) Development support for LED-related materials (such as LED chips, junction materials, lead frames, substrates and sealing resins)


[Industry]
Manufacturing industry

[Strength of products/technologies]
(1) We can identify and adjust in advance areas where problems are likely to occur, based on our experience in production and trial manufacturing, thereby creating and proposing trial manufacturing specifications. (Proposal in advance for experimental design)
(2) We can propose material development on the basis of the latest development trends, since we have many customers.
(3) We can manually handle bare chips, and thus can plan and execute multi-level, small-quantity experiments at the initial stage of development.
(4) We can undertake the technical elements of bare chip die bonding (junction technology such as soldering, AuSn, silver paste), wire bonding (junction using Au or Ag wire), resin sealing (potting, transfer), reliability testing, and other technologies.


[Representative's message]
Domestic consumer electronics manufacturers switched to overseas production after the collapse of the bubble economy, and many domestic processing contractors went out of business as a result. Furthermore, major consumer electronics manufacturers cannot even evaluate prototypes created in-house or by a contractor. There are very few companies remaining to which domestic material manufacturers can consign the production of evaluation samples when they wish to sell new materials overseas. We are expanding our sales channel in the consumer electronics market, from our historical focus on trial manufacturing and mass production start-up for major consumer electronics manufacturers.

[Company structure for market development/overseas expansion]
(1) We are expanding purchasing channels for overseas materials in the procurement of active materials, and expanding the scope of trial manufacturing.
(2) We have developed the ability to perform thermal characterization by receiving a “Monozukuri” (craftsmanship) subsidy.
(3) We endeavor to make customers’ plans easy to understand by using 3-D CAD and 3D modeling.



[Awards and media coverage]
[Awards]
Hyogo Power Utilization Rationalization Promotion Association (effective and efficient power utilization)

[Media]
Journal of Hyogo Prefectural Federation of Societies of Commerce and Industry (July 10, 2015), Interviewed for “LED Special” by Kobe Shimbun (published in November 27, 2014 edition)


[Authorization/Certification]
Compliance with Step 2 of Kobe Environmental Management System (KEMS) 

[Joint research and development]
Kyoto University, Yamaguchi University, Okayama Prefectural University, Meijo University, Chiba University, Panasonic, Sharp, Toshiba, major chemical manufacturers and other companies

[Main Clients / Business History (domestic)]
Omron Corp., Ushio Epitex Inc., Sanyo Electric, Dainippon Screen, Harison Toshiba Lighting, Mitsubishi Electric, NOK, Toray Engineering, and other companies

[Main Clients / Business History (overseas)]
Seoul Semiconductor

This company is recommended by the following support organizations.

Kansai Head Office, SMRJ
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