Corporate
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Sales Pitch

Development of high-speed boards

Board development:
Our company develops hardware and software by using our high-speed transmission technology and noise prevention technology, as well as collaboration with partner companies. This way, we can handle both analog and digital technologies, such as image-processing, high-speed digital communication, FPGA embedded boards, analog/wireless communication, and power supply circuits.

(1) We deal with medical equipment, analytical equipment, machining tools, industrial robots, semiconductor equipment, communication equipment, OA equipment, and so on.
(2) Function design, specification development, logic design, circuit design, and FPGA design are performed through specification meetings. We can act on your behalf starting from the specification development phase, by having meetings.
(3) In addition to firmware, middleware and application development, we offer the latest embedded technology in a wide range of fields from image processing to control software development.

Support for high-speed signal transmission:
Based on signal quality and required specifications (area, power, etc.), we design patterns considering the design guides and past results published by JEDEC and memory manufacturers, simulating the placement of reflection, crosstalks, via holes, and bypass capacitors. When the design is complete, post-simulation is performed to verify the validity of the design. At this point, we check even the risks that do not appear in the circuit diagram, such as timing simulation, simultaneous switching noise, and via-to-via crosstalks to stabilize behaviors.

Support for high density:
Our company supplies suitable printed circuit boards for the needs of each field, such as medicine and telecommunications, in addition to the general industrial sector. We meet a wide range of needs, including characteristic impedance control, transmission loss control, environmental regulations compliance, high-density/high multi-layer, low dielectric constant/low loss material, high-mix low-volume, mass production, and overseas supply.
Short-term production: Three days (min.) for eight-layer penetration boards, and four days for one-stage built-up boards.
Material/technology for high speed: High-frequency materials such as Megtron6, back drills, through-hole pads that match impedance, and Megtron7 compatibles.

Consulting

Analyzing the characteristics, and improving the defects of high-speed signal transmission patterns:
•Improve signal quality from the actual unit.
We identify the cause of signal transmission issues such as data errors by using a broadband real-time oscilloscope. 
•Analyze the characteristics of the signal transmission route
To determine the cause of signal transmission issues and to create a simulation model, we measure the transmission loss, characteristic impedance, and crosstalks of the printed circuit board using a broadband network analyzer.

Noise reduction support (3 iNARTE-certified EMC engineers):
•Near electromagnetic field measurement
Identify the source of specific frequency noise that has become a problem as radiation noise, and evaluate the spread of noises within the board. Take countermeasures such as adding offsetting components to where unnecessary electromagnetic field distribution was found, and verify the improvement effect.

Measures against heat:
We measure the actual product as necessary and derive the best component placement and board design guidelines for heat dissipation. Also, we present a concrete design proposal including heat sink structure design and chassis (screw fastening positions, air hole shape, size, location, etc.).

Printed circuit board production

Efforts for high-mix low-volume production and short term delivery:
•Prototypes are delivered in a short time.
Three days for eight-layer penetration boards, and four days for one-stage built-up boards.
•Standard characteristic impedance control
•Quality assurance
AOI for inner layer circuit / AVI for final inspection / Guaranteed continuity for all products (flying probe inspection)
-Confirmation of basic quality to ensure high reliability
Copper plating properties (elongation rate (%), tensile strength (kgf / mm2)) / high-speed transmission characteristics (single-end S11, differential Sdd21)

Supplying through mass production:
•Domestic production
We ensure consistent quality between prototypes and repetitive orders and accept orders from a single board.
•Overseas production
Meets the needs for a low price; centralized control from prototyping to overseas mass production (offshoring); characteristic impedance control; appearance inspection based on the customer's specifications; quality assurance; support for double-sided to multi-layer, OUT-IN, OUT-OUT
•Cooperation with overseas partner companies
From prototyping to mass production (supply), we utilize the specialties of our partner companies, such as package substrates, component-embedded substrates, and rigid-flexible boards.

Other presentation

[Company strength]
Our company provides printed wiring boards, services, solutions, and wisdom to manufacturers of equipment for industry and social infrastructure. We contribute to the growth and development of our customer's business by making use of our uniquely differentiated technical and design power. All of our staff are aware of customer issues through customer understanding (marketing) activities and continuous talks with customers. We always strive for customer trust by providing significant services and solutions (wisdom) to customer issues.

[Business description]
Our company offers (1) pattern design and simulation, (2) printed wiring board manufacturing and part mounting, and (3) consulting services.

[Industry]
Electronic part, device, and circuit manufacturing

[Strength of products/technologies]
(1) Pattern design and simulation: We have advantages in pattern design and simulation for noise-resistant printed wiring boards that support high-speed signal transmission.
(2) Printed wiring board manufacturing and part mounting: We meet various customer needs for characteristic impedance control, transmission loss control, and compliance with environmental regulations. We manufacture high-density, multilayer, low-permittivity, or low-loss products by high-mix low-volume production or mass production, and we also provide them outside Japan.
(3) Consulting services: Our company identifies problems and proposes solutions by making use of our own electronic measuring units and simulation software.


[Representative's message]
Our company is a comprehensive manufacturer of printed wiring boards inaugurated in April 2014. We perform pattern design and simulation, trial manufacturing, and mass production to supply products, and also provide consulting service to support problem solutions from the customer development stage. We hope that we will be of some assistance to streamlining customer development, and ensure a high level of trust. We also provide the same services to overseas customers as we do in Japan under the integrated management of our overseas partner production companies and quality management sites. Do not hesitate to consult us.

[Company structure for market development/overseas expansion]
Our company started outsourcing manufacturing more than 10 years ago with a focus on China. We prepared quality assurance departments at the local sites and Chinese-speaking staff in Japan to establish a quality assurance system. We have sales staff dedicated to overseas manufacturing to meet inquiries from major  and overseas companies. Our staff in the technical and sales departments directly visit customers for technical consulting to solve issues.

[Awards and media coverage]
[Awards]
The Japan Institute of Electronics Packaging, spring convention, MES 2011 award (Best Paper Award).

[Media]
The Japan Institute of Electronics Packaging, "Monthly EMC," etc.


[Authorization/Certification]
ISO 9001, ISO 14001

[Joint research and development]
Lecture at The Japan Institute of Electronics Packaging.

This company is recommended by the following support organizations.

Chubu Head Office, SMRJ