Corporate
Profile

[Company strength]
We provide plating in mass volume as well as advanced electroless gold and copper plating for printed circuit substrates using our plating and management techniques accumulated through years of operation., We have an advanced level of film characteristics as the industry pioneer in electroless gold plating technology. In addition, we introduced new techniques for nickel, palladium, and gold plating. Thus, we provide and supply products that meet the demands of our customers. For copper plated through-hole substrates, our high-quality and swift mass-production technology enjoys high praise. Through our meticulous analysis, management and research, we can cover a wide range of products from high-mix low-volume mass-production to special substrates with the industry’s top class plating quality. Furthermore, our Technology Center, which started operation in 2006, also conducts filled plating with super-thin substrates, through-holes and laser-via holes with copper plate.

[Business description]
The demand for high quality substrates, including high reliability printed interconnection substrates for vehicles and onboard devices, is expected to increase continuously in the future. In addition, advanced surface treatment technology from the frontline of product development, where state-of-the-art technology is key to survival, is required for communication and mobile equipment, computer and related equipment, amusement equipment and a variety of digital home electric appliances. Plating technology, which is the key technology for those products, must constantly improve reliability. As a specialist in gold plating for printed interconnection substrates and copper plating, we do our very best to maintain advanced equipment and production systems and reinforce the skill of engineers in order to ensure high quality products, flexibly respond to requests for advanced specifications or to specification changes.

[Industry]
Plating

[Strength of products/technologies]
As the industry’s pioneer in electroless gold plating technology, we boast the highest-level film characteristics and are also capable of doing nickel, palladium, and gold plating. We are known for our high quality and swift mass-production techniques for copper plating. Our product line covers mass production of plating thick plates as well as super thin substrates, filled via and through-hole filled plating. All our sites can conduct research, analysis, technical development, production management, inspection, and shipment with a high level of comprehensive strength. Each department uses a real-time management network system to ensure flexible and swift response to various requests and specifications with high quality as the top priority.

[Representative's message]
We started in the plating business in 1952 and have accumulated a variety of plating techniques since then. Using those established techniques, we can copper-plate super thin substrates or flexible substrates used in module products as well as thick substrates including multi-layered substrates. We also introduced advanced techniques including copper filled via plating and through-hole filled plating as our new products and mass-produce products using our equipment adjusted specifically for the order. For gold plating, we conduct high-volume plating including thick gold plating or flash gold plating used in bonding and nickel-palladium gold plating that sandwiches palladium plating between nickel film and gold film. Thus, we actively take actions to cope with new specifications and products to satisfy customer requests. All of our employees constantly endeavor to maintain this standard.



[Company structure for market development/overseas expansion]
We cope with various needs ranging from swift high-volume plating to high-mix low-volume production. In our copper plating factory, the round-the-clock operation system ensures constant production of high-quality products. Our gold plating factory meets quick-turn around delivery requirements using a flexible production system that changes according to the day’s production volume. We are a unique company that adapts to various changes including sudden line schedule or specification changes, coupled with our unique network management system that allows us to check the information on line operation or customers’ processed products. We use these advantages to proactively explore new sales channels. Our present main business is electrolytic and electroless gold and copper plating for printed interconnection substrates. We can also handle varying techniques and materials using the resin plating technique, thereby creating or finding new needs.

[Market share/Ranking]
We believe we have a certain market share according to our past delivery record.

[Awards and media coverage]
[Awards]

[Media]
Electronic Device Industry News, published an article on us in the April 30, 2015 issue



[Authorization/Certification]
ISO 9001 certification acquired in 2000 and ISO 14001 in 2004

[Main Clients / Business History (domestic)]
Manufacturers of electric products, printed interconnection substrates, and other electronic components

[Exhibition History/Information]
Participated in JPCA Show 2015