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Latest update： 30/11/2016 18:02:10
Ings Shinano Co., Ltd.
We provide mounting and assembly of liquid crystal panels from trial manufacturing to low-volume mass production.
We manufacture and sell electronic device modules. We also manufacture and sell information equipment. We have good record of performance in liquid crystal panel mounting and assembly, and accompanying film bonding and semiconductor bare chip mounting, and in touch sensor panel mounting and assembly. We support orders from trial manufacturing to low-volume mass production. We have acquired ISO 9001 and ISO 14001 certification, and have received an LOC for conformance with the ISO/TS 16949 QMS. We operate and control our system with a quality management system equivalent to one for in-vehicle products.
[Company strength] We have acquired ISO 9001 and 14001certification, and also an LOC from Bureau Veritas indicating conformance with the ISO/TS 16949 QMS. We operate and control our system with a quality management system equivalent to one for in-vehicle products. We actively accept orders for low-volume mass production products and consignment manufacturing of prototypes and experimental items, which are disliked in the electronic device industry. [Business description] We provide consignment mounting and assembly of flat-panel displays, and accept orders from trial manufacturing to low-volume mass production. We deal with the bare die mounting that accompanies wire bonding and flip-chip bonding, and accept orders from trial manufacturing to low-volume mass production. We also conduct consignment assembly of precision instruments and OA equipment. [Industry] Electronic device module and information equipment manufacturing and sales [Strength of products/technologies] (1) We can provide flexible support for various kinds of film bonding in the areas of liquid crystal panels and touch sensor panels and support. This is how we can smoothly develop the flow from trial manufacturing to mass production startup. We can also carry this out from the design stage, so our customers are not bothered at all. (2) We can support multiple methods in the areas of custom control substrates and sensor mounting and assembly of sensors. These include wire bonding (gold, aluminum, and copper) and flip-chip bonding (ACF and various resins) as semiconductor bare die mounting methods. Our products can be utilized in a wide range of areas from consumer products to control substrates for social infrastructure, as well as the development of MEMS sensors. This is because they can be applied to airtight sealing packages by using seam welding. [Representative's message] We focus on experimental items, prototypes, and low-volume current products, which are often forgotten in the electronic device industry, and we accept orders in these areas. The factory engineers of major manufacturers conduct manufacturing equipment model setup changes once every several days, but our factory engineers conduct several setup changes within one day. We hope to maintain a role as an experiment and trial manufacturing expert that can accelerate the development of new products by customers. This will be done by making use of the know-how and knowledge we are accumulating in our processing work. We have a sufficiently flexible system. We hope to actively receive orders for the low-volume mass production of industrial equipment, etc., which is disliked by overseas OSAT (Outsourced Semiconductor Assembly and Test) companies. We mainly do business in Japan at present, but we are working to enhance our technological power in order to develop a wide global market, including the Asian region. [Company structure for market development/overseas expansion] We have established a quality assurance system conforming to TS 16949, which is the automobile quality standard. In 2013 we received an LOC from Bureau Veritas in the field of our electronic device mounting business. We perform in-house operations in conformance with the severe quality management system for the automobile industry field. Major companies in other fields can also place orders with us for experiments, consignment trial manufacturing, and consignment production with a “seamless” feeling. Customers can use us like their own in-house factory. [Market share/Ranking] Mounting and trial manufacturing of electronic device bare dies: 5% share of the domestic Japanese market (estimated by our company). Trial manufacturing of liquid crystal panels: 10% share of the domestic Japanese market (estimated by our company). [Awards and media coverage] [Awards] [Media] Our technology and acquisition of the TS 16949 LOC were reported in local newspaper articles, in the local columns of national newspapers, and so on. [Authorization/Certification] Whole company: Acquired ISO 9001/14001 certification. Electronic device mounting business, Shiou office: BV-LOC-3088036-M1, indicating conformance to ISO/TS 16949 QMS. [Joint research and development] We have concluded many consignment contracts on experimental samples and prototypes of sensors, antennas, indicators, etc. These include contracts with Hokkaido University, Tohoku University, University of Tokyo, Tokyo Institute of Technology, Nagoya University, Kyoto University, and Osaka University. [Factory (domestic)] Nagano
This company is recommended by the following support organizations.
- Marketing Support Department, SMRJ
- Kanto Head Office, SMRJ