Corporate
Profile

[Company strength]
In response to the oil crisis our company started to work with universities in the form of industry-university collaboration to actively refine our advanced cutting and polishing technologies. We made use of the latest information, direct guidance, and joint development as opportunities, and became the first in the world to be able to cut and grind silicon wafers. This technology is attracting attention both in Japan and overseas, and especially in the field of photovoltaic power generation. We can now provide technical guidance anywhere in the world. Our small-diameter polishing technology is also highly valued, and has been adopted for iPad pen parts.

[Business description]
Our company has been engaged in various fields by applying our core precision processing technologies such as machining and polishing to a wide range of products. These range from electronic parts to solar power substrates. Our company was able to celebrate 54 years since our founding with a certain presence in the industry. This was thanks to the trust we have earned from our domestic Japanese and overseas customers.

[Industry]
Electronic material precision processing

[Strength of products/technologies]
Our small-diameter polishing to diameter 2 and 0.02 mm in thickness has earned high evaluations. Almost 100% of the small-diameter variable condensers around the world are our products. Our company was the first in the cutting field to succeed in using diamond wire cutting technology for mass production. We also downsized the wire gage to diameter 0.07, which reduced kerf loss by 30%. This success has been valued highly by users, and reinforced our connections with major manufacturers in Japan and overseas. 

[Representative's message]
I am glad that our company has been able to reach its 54th year. Some say that a company’s life is limited to 30 years. I feel that this depends on whether the company is needed in the market, and whether the company has technologies or products that are needed at a given time. However, the environment surrounding Japan’s manufacturing sector is severe, and we cannot expect to survive with mediocre technology and products. This is why we will further enhance our polishing and cutting technologies, and make use of our technologies in developing new materials. 

[Company structure for market development/overseas expansion]
Our fundamental policy is to advance speed and technology. We adopted a divisional system, and merged our sales and development departments into a single department to more quickly respond to customer needs. 

[Market share/Ranking]
Variable condenser processing (60% of the world market; includes large, medium, and small diameter substrates); solar power substrate processing (20% of domestic Japanese production).

[Awards and media coverage]
[Awards]
Japan Society for Precision Engineering, Contribution Award (2012). 

[Media]
Sanyo Broadcasting, “Okayama Company Selection 2013.”


[Authorization/Certification]
ISO 9001, 14000.

[Joint research and development]
Osaka University: Development of nano Si powder.
Kyoto Institute of Technology: Development of single-crystal SiC and bonding technology.


[Main Clients / Business History (domestic)]
Company P (solar power cell substrates, 40%); major electronic parts manufacturer P (processing of variable parts, 100%); major electronic parts manufacturer T (nose filter part processing, 100%).

[Main Clients / Business History (overseas)]
We manufacture substrates for our technology partner in China (a photovoltaic power generation company listed in Hong Kong).