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Latest update: 30/11/2016 17:58:08

TOYO Oriental Molding Co., Ltd.

We design, develop, and manufacture plastic-molding processed products.

We carry out integrated production from resin material development to product design, 3D-printer trial manufacturing, strength testing, die design, trial manufacturing, and mass production. We have the top domestic share of 30% in the field of chip trays for semiconductors. We are expanding our business to many areas such as aircraft, health care, and optical equipment. We manufacture 24 hours a day using 50- to 650-ton molding machines under a clean environment.

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[Company strength]
Our company has a product design division that can quickly realize the customer’s concept using DCAD (SolidWorks), CAE (Moldflow), a 3D printer (Agilista), etc. The shape and strength of the materials and products are analyzed for quality control using a 3D measurement instrument, laser surface-shape analysis, a 5000-power microscope, a tensile test instrument, etc. We manufacture 24 hours a day using 50- to 650-ton molding machines under a clean environment (Class 100,000 to 10,000). We have a thermosetting resin molding division, and we can convert the use of dies from plasticity to hardening.

[Business description]
We design, develop, and manufacture plastic-molding processed products. 
We carry out integrated production using 50- to 650-ton high-temperature high-pressure molding machines. We support services from resin material development to product design, 3D-printer trial manufacturing, strength testing, die design, trial manufacturing, and mass production under the ISO 9001 quality system. This is done according to consignment manufacturing contracts and customer needs.


[Industry]
Plastic product manufacturing

[Strength of products/technologies]
(1) Conductive resin applied technology: Development according to needs for countermeasures against static electricity using CNT, ceramic fiber, carbon fiber, ion conductive resin, etc. 
(2) Molding processing technology for hard-to-process resin: We have a variety of facilities such as PEEK, polyimide, high-temperature high-pressure molding with 60% CF/GF content, and thermosetting resin (phenol and BMC). We have developed a tough weld molding process that improves weld intensity.
(3) We developed a low linear expansion resin, and glass/resin integration technology.
(4) We have independently developed conductive resin, and realized in-house production of semiconductor chip trays. 


[Representative's message]
Our company has been continuously engaged in the molding processing of industrial plastic products for 53 years since its foundation in Tanashi (now Nishi-Tokyo) city, Tokyo.
Most of our products are supplied for semiconductors and electronic components. Design control and quality control of tray jigs for the semiconductor industry are conducted mainly in-house under consignment design contracts. We are taking advantage of our accumulated experience in special material processing to expanding our business in different fields, such as aircraft, health care, optical equipment, and building materials. This is based on our technology for material improvement, in-house product design, and the development of jigs and tools. Our aim is to develop our customer’s products as a development partner, by making full use of our 3D printer and flow analysis.


[Company structure for market development/overseas expansion]
We have established a corporate organization that can quickly deal with technical issues regarding the customer’s needs for mass production, modification, development, etc. This is done by integrating our product design division with the sales division. We have established a corporate organization that can make proposals on quality and cost using new materials and new manufacturing methods. This is done by integrating our quality assurance division with the manufacturing technology division for cost reduction. We are strengthening our ties with universities, material-related research institutions, etc., through the Prefectural Industrial Development Corporation and enhancing our analysis and development capability. Areas in the Kanto region and north are covered by our company, and areas in the Kansai region and west are covered by an entrusted trading company.

[Market share/Ranking]
We have a 30% share of the market for chip trays for semiconductors (the top share in the domestic Japanese semiconductor industry).

[Authorization/Certification]
Received ISO 9001certification.
Strategic Core Technology Advancement Program approval.


[Joint research and development]
Tokyo Denki University (electromagnetic induction heating dies), Shibaura Institute of Technology (reflow jig analysis), and the Industrial Technology Center of Saitama Prefecture (resin intensity analysis). 

[Factory (domestic)]
Saitama, Niigata

[Transaction form]
Orders for trial manufacturing and development, OEM contracts, licensing contracts, joint development, sales of products, and so on.

[Main Clients / Business History (domestic)]
Murata Manufacturing, Mitsubishi Materials, Hitachi Industrial Equipment Systems, Minebea, Renesas Electronics Corporation, and 20 other companies listed on the stock market.

[Main Clients / Business History (overseas)]
ON Semiconductor, Freescale Semiconductor, and Micron Technology.

[Exhibition History/Information]
INTERNEPCON
Saitama Business Arena 
Nano Micro Business Exhibition (planned)


This company is recommended by the following support organizations.

Kanto Head Office, SMRJ
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