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Latest update: 30/11/2016 17:45:57

Kumamoto Bosei Co., Ltd.

We offer manufacturing using semiconductor IC surface treatment and precision metal working as core technologies.

We are expanding our semiconductor-related business. This includes IC lead frame partial silver plating and depressing and taping processing as well as IC exterior plating and lead processing. We also wash jigs and tools used in the IC manufacturing process, distribution containers, etc. We promote R&D on surface treatment technology targeting plating trial manufacturing and mass production. There is a recent trend toward enhancing semiconductor density and integration. This is why we have established technology to apply precise silver plating and pressing of lead frames and have delivered these products to our customers. We possess an in-house wastewater treatment system in consideration of the environment. 


[Product description] Plating quality requirements are becoming much higher as IC lead frames are becoming larger with higher precision. We seek to satisfy our customers by realizing partial silver plating that requires high precision. To do this we also use an automatic visual inspector equipped with high-definition, high-precision partial silver plating equipment, and image processing technology. [Authorization/Certification] Acquired ISO 9001 certification and ISO 14000 certification. Strategic Core Technology Advancement Program approval. [Major facilities and equipment] Partial silver plating equipment, depressing and taping equipment, automatic visual inspector, ICP analyzer, and wastewater recycling facility.

[Product description] IC mountability is improved by applying exterior plating to the semiconductor IC frame in the semiconductor post-assembly process. The ICs connected in the frame shape are then separated individually and subjected to lead pressing processing, and the lead form is arranged. [Authorization/Certification] Acquired ISO 9000 certification. [Major facilities and equipment] Exterior plating equipment, automatic post-plating visual inspector, lead processing equipment, and lead formation measuring equipment.

[Product description] We wash various containers and magazines for distribution using beads and neutral detergent. We also wash wafer injection rings and transporter trays with pure water, and then dry them with warm air. [Authorization/Certification] Acquired ISO 9000 certification. [Major facilities and equipment] Container and magazine cleaning equipment, ultrasonic cleaning equipment, cleaning equipment for rings used for injection in IC upstream processing, and tray cleaning equipment.


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