Corporate
Profile

[Company strength]
We have been promoting the expansion of our business as a pioneer of plating in Kumamoto since our foundation in 1933. We have gained our customers’ trust through our plating work for semiconductor components used in home appliances, communication devices, in-vehicle products, PCs, etc. We also contribute to the development of local society by performing environmentally friendly business activities. Our group affiliate company Kumabo Metal specializes in applying special surface treatment onto large-sized components for liquid crystal-related and semiconductor manufacturing equipment. 

[Business description]
We are expanding our semiconductor-related business. This includes IC lead frame partial silver plating and depressing and taping processing as well as IC exterior plating and lead processing. We also wash jigs and tools used in the IC manufacturing process, distribution containers, etc. We promote R&D on surface treatment technology targeting plating trial production and mass production. 

[Industry]
Semiconductor component surface treatment (plating processing) and processing 

[Strength of products/technologies]
We have established the technology in our IC lead frame business to perform ultra-high-precision silver plating and precision pressing for lead frames. This is in step with the trend of rapid growth in the density and high integration of semiconductors. We already supply our products to many customers. We have established a system in the area of IC exterior plating that realizes various kinds of lead-free plating technology, as well as quick deliveries. We do business with major semiconductor manufacturers. We have in-house wastewater treatment system technology in consideration of the environment. 

[Representative's message]
Our company has been engaged in various industrial fields since its foundation in 1933. We have maintained good connections with local society and our customers, and contributed to their growth.
We are currently developing surface treatment processing for semiconductor IC manufacturing and related precision metalworking as our core technologies. We celebrated the 80th anniversary of our foundation last year, and we launched a challenge to expand new development in peripheral areas. We will do this by taking advantage of our accumulated original surface treatment technology, know-how such as quality control, joint R&D under industry-university-government collaborations, and our diverse human resources. We hope to expand our business from local society to the world with the inclusion of such new business areas.  


[Company structure for market development/overseas expansion]
Both our lead frame division and IC division have established sections for customer support. They have assigned sales staff and engineering staff who will work as points of contact with customers under the direction of the director of each division. Our development office and new business development division will be the points of contact with customers for consultation about new surface treatment, process development, etc.

[Awards and media coverage]
[Awards] 
Higo Water Resources Protection Award, 2003; METI Bureau Director General’s Excellent Energy Management Factory Award, 2003; Agency of Natural Resources and Energy Director General’s Excellent Energy Resources Award, 2005; Higo Water Resources Protection Special Award, 2006. 

[Media]
TV reports on the “Higo Water Resources Protection Awards,” 2003 and 2006; report in the monthly magazine “National Society,” “Eco-activity in SMEs,” 2010. 

[Authorization/Certification]
Acquired ISO 9001 certification and ISO 14000 certification.
Strategic Core Technology Advancement Program approval.


[Joint research and development]
(1) Joint R&D with the National Institute of Advanced Industrial Science and Technology and the Kumamoto Prefectural Industrial Technology Center, “High-precision IC lead frame manufacturing using three-dimensional plating processing evaluation technology development.”
Approved as a Strategic Core Technology Advancement Program project, 2010.
(2) Joint R&D with the National Institute of Advanced Industrial Science and Technology and Osaka Prefectural University, “Development of minimal TSV plating equipment.” 
Approved as a Strategic Core Technology Advancement Program project, 2013.


[Transaction form]
Policy development, joint development, consignment processing, and so on. 

[Transaction terms]
Situations differ according to the customer, so terms and conditions are decided by means of individual negotiations.

[Main Clients / Business History (domestic)]
Mitsubishi Electric, Renesas Electronics, J-Devices Corporation, Dai Nippon Printing, and Toppan Printing.  

[Main Clients / Business History (overseas)]
We have a track record of transactions in the lead frame business and the exterior plating and post-processing business with overseas companies (in China, Taiwan and other countries). This is done via our major customers in the semiconductor manufacturing industry.