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Latest update: 08/02/2017 17:43:44

ANDO DK Co.,Ltd.

We develop bonding and sealing materials according to needs, and we are capable of small lot production.

We mainly manufacture and sell bonding materials for semiconductor devices and sealing materials for LED and bipolar IC devices. We have extensive experience in the mixing and blending of epoxy resins. We can develop and manufacture various kinds of bonding and sealing materials. Our materials have been applied in many semiconductor devices and are also used in automotive ICs and LSIs. Products we supply after development with the customer are extremely reliable and have been applied in uses other than electronic parts.

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Other presentation

[Company strength]
Our company develops bonding and sealing materials for fields where high performance and reliability are expected. We have facilities supporting high-mix low-volume production, and also performance analyzers necessary for development. We can develop and produce bonding and sealing materials meeting user performance requirements, even in small lots. We supply products not only in Japan but overseas as well.

[Business description]
We develop, manufacture, and sell bonding and sealing materials for semiconductor devices (LED, IC, LSI, MEMS, and power devices). We also develop products according to client requests as an R&D company.

Semiconductor package resin material manufacturing

[Strength of products/technologies]
We have extensive experience in the mixing of epoxy resins and various blending materials. We can develop and manufacture semiconductor packaging materials. Our materials have been applied in many semiconductor devices and are also used in automotive ICs and LSIs.

[Representative's message]
Our products are developed from materials selection to manufacturing with consideration of their impacts on people and nature. We will meet your requests by continuously improving our product development strength and quality.

[Company structure for market development/overseas expansion]
We are strengthening our links with local trading firms to meet the requirements of overseas customers. We are also actively exporting products to Taiwan, China, Korea, Malaysia, Europe, and Russia.

[Awards and media coverage]
Feature in The Chemical Daily (December 2012); JCOM (cable TV), “Kigyo Tambo” (February 2013).

ISO 9001 and ISO 14001 certification (April 12, 2012).

[Transaction form]
Orders for trial manufacturing and development, joint development, and product sales.

[Transaction terms]
Based on our terms and conditions. FOB (Narita Japan) by air only for overseas.

[Main Clients / Business History (domestic)]
LAPIS Semiconductor (OKI Semiconductor), Canon Components, Kodenshi, and Koha.

[Main Clients / Business History (overseas)]
Vishay (USA), Lingsen (TW), Sigurd (TW), Everlight (TW), TSMC (TW), and Epistar (TW).

[Exhibition History/Information]
NEPCON Japan 2014; Semicon Taiwan 2013; Semicon Shanghai 2012; SME Expo 2012; IC Packaging Technology Expo 2015 (scheduled).

This company is recommended by the following support organizations.

Kanto Head Office, SMRJ

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