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Latest update: 02/09/2022 14:07:22

SANSHIN Co., Ltd.

We developed environmentally friendly tape-type polishing equipment that reduces fuel consumption and CO2 emissions. 

Our company develops and manufactures tape-type super-finish polishing equipment. We adopt a lapping film processing method as a polishing tape technology. This enables nano-scale processing of various surfaces, including flat and curved surfaces, the inside and outside surfaces of cylinders, and irregular surfaces. We have developed an extensive lineup for many kinds of processing, such as processing of flat surfaces, spherical surfaces, and curved surfaces. 

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[Product description] We can provide ultra-precision polishing of various surfaces. This includes nano-scale processing of flat and curved surfaces, the inside and outside surfaces of cylinders, and irregular surfaces. Characteristics of tape-type super-finish polishing are as follows: It realizes ultra-precision polishing up to 0.01 µ. Roughness can be controlled easily, and various tapes are available. The surface can be finished evenly. It can process a surface to create roughness, while removing minute burrs at the same time. It can be used either in a dry or wet mode.* (*The dry mode is more common, but this processing does not generate much dust.) The machining environment can be clean and minimal It can be completed quickly, in a speedy manner. If used in dry mode, it can help reduce labor in the cleaning process. Polishing conditions such as grindstone wear and tear do not have to be adjusted. It is easy to replace the abrasives. Even inexperienced workers can apply super-finish polishing. Our tape-type super-finish polishing is gaining attention as an unconventional processing method especially in the silicon wafer industry, where diameters are being enlarged and refined. [Major facilities and equipment] Various tape-type polishing test machines; image measurement microscope (Keyence VH-5500); surface roughness measuring instrument (Tokyo Seimitsu Surf Com 1800); roughness meter (Kosaka Laboratory SE500), and so on.

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