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Latest update: 27/04/2017 13:59:34

HARMOTEC corporation

We contribute to semiconductor manufacturing through noncontact transfer technology and low-stress transfer technology for ultrathin wafers.

We deal with special-shape wafers and cells, and have acquired the largest share of the world market through our unique patented technology. A whirlwind is generated within our CUP transfer equipment, and the pressure occurring in the core of the whirlwind is used to transfer a product. This transfer equipment was created from a new concept that solves common problems such as scratches on the product, dust adherence, and porous cushioning materials not being absorbed for transfer. Our company’s elite personnel can cover a wide range of operations, from development to production. 



Corporate name HARMOTEC corporation
Representative Hitoshi Iwasaka
Corporate website
Capital 10,000,000(JPY)
Number of Employees 10
Established date 1982
Head office: Country Japan
Head office: Address 4‐1‐32, Sumiyoshi, Kofu, Yamanashi, 400-0851
Industry Manufacture of general machinery
Annual Sales 175,000,000 (JPY)
Main phone number +81-552986690