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Latest update： 27/04/2017 13:59:34
We contribute to semiconductor manufacturing through noncontact transfer technology and low-stress transfer technology for ultrathin wafers.
We deal with special-shape wafers and cells, and have acquired the largest share of the world market through our unique patented technology. A whirlwind is generated within our CUP transfer equipment, and the pressure occurring in the core of the whirlwind is used to transfer a product. This transfer equipment was created from a new concept that solves common problems such as scratches on the product, dust adherence, and porous cushioning materials not being absorbed for transfer. Our company’s elite personnel can cover a wide range of operations, from development to production.
|Corporate name||HARMOTEC corporation|
|Number of Employees||10|
|Head office: Country||Japan|
|Head office: Address||4‐1‐32, Sumiyoshi, Kofu, Yamanashi, 400-0851|
|Industry||Manufacture of general machinery|
|Annual Sales||175,000,000 (JPY)|
|Main phone number||+81-552986690|