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Latest update： 09/01/2020 15:25:07
FUKOKU INDUSTRY CORPORATION
We manufacture electronic information communications equipment that has been adopted in the aviation and space fields, such as equipment onboard artificial satellites.
We have been developing our business with a focus on printed circuit board (PCB) mounting and the assembly of the high-density electronic devices. We have further refined out integrated consignment system for electronic information communications equipment, from product planning and design to material supply, manufacturing, and testing. We have abundant experience in manufacturing equipment for major companies, the aerospace industry, and communications infrastructure facilities. We also develop and provide high-speed chargers for lead storage batteries and regenerating equipment for lead batteries as our in-house products.
EMS business centered on high-density baseboard implementation We take part in the initial stage of product development and offer accurate support. We provide comprehensive support for the entire product development process from circuit design, board design, and casing design to implementation, assembly, prototyping, material procurement, production, and cost management. We can take on orders for any process from design to testing in electronic equipment manufacturing. We will contribute to improving customer productivity with our products and services with high quality and cost effectiveness. We achieve this by deploying exclusive staff for production innovation and continuing daily productivity improvement activities.
Five surface-mount lines (screen printers, solder printing inspection devices, high-speed adhesive applicators, high-speed microchip loaders [available for up to 0402], irregular-shaped part installers, N2 reflow devices, substrate appearance inspection devices, laser markers, X-ray inspection equipment, jet soldering machines, table-top soldering robots, ultrasonic washers, etc.)
We have a track record of substrate implementation for various fields including optical communication devices, radio-wave application equipment, cellphones, displays, and security systems.
[Company strength] We have abundant experience in manufacturing equipment for major companies, the aerospace industry, and communications infrastructure facilities. We have acquired ISO 9000 and ISO 14000 certifications. Our goal is to realize complete quality assurance by supporting the severe control standards required by our customers, and by developing our corporate activities for quality improvement. We have constructed a high-efficiency production line according to the use of the products and the production scale (from mass production to high-mix low-volume production). This is how we can assure the quality and the delivery time, and realize cost reduction. [Business description] We have been developing our business focusing on printed circuit board (PCB) mounting and the assembly of the high-density electronic devices since our foundation. We have now further developed this business. We have prepared an integrated consignment system for electronic information communications equipment, from product planning and design to material supply, manufacturing, and testing. This is how we can offer overall cost reductions. We can cover from high-reliability products such as equipment onboard satellites to general consumer products. This is based on the extensive skills and know-how we have accumulated so far. We also develop and provide high-speed chargers for lead storage batteries and regenerating equipment for lead batteries as our in-house products. [Industry] Electronic equipment manufacturing [Strength of products/technologies] We have introduced high-speed mounting and high-density, self-mounting equipment to support product downsizing (such as BGA 0603 chips, 0.2-mm narrow neighboring, and flexible substrates). We have 60 qualified hand-soldering experts, so we can conduct mass production of irregular-shaped parts such as power supplies. We have installed a cleanroom (320 square meters) and wire bonding equipment. We have skilled technicians who are capable of high-mix low-volume bare chip mounting (semiconductor parts, etc., mounted in a bare state). We can also assemble products such as liquid crystals that cannot tolerate debris. We possess high-speed, advanced IC&C method charging technology, which simultaneously realizes the advantages of cost performance and convenience. [Representative's message] We have mainly been subcontracting electronic substrate mounting since our foundation in 1988. We have made continuous efforts to take on the challenge of the high skills required by major companies in the integrated assembly of electronic equipment. This is why we receive high evaluations today and receive orders continuously. In 2008 we started to develop a business including the development and sale of high-speed chargers for lead storage batteries, which are our in-house products. We also established a management vision 5-year plan in 2013. We are working hard on management innovation, with the goal of being a company that can deeply impress our customers with our good products and services. [Company structure for market development/overseas expansion] We have accumulated an extensive track record of transactions with major companies. Our sales staff are assigned according to the customer. Products are delivered using our own trucks, and we maintain close face-to-face relationships with our customers. The staff in our technical and manufacturing departments will support technical consultations. They will visit the customer directly if necessary in order to solve problems. We assign a sales promotion manager for customers of our in-house products. This is done to provide sincere support to overseas customers, including the collection and management of information. [Authorization/Certification] Acquired ISO 9001 certification (2000). Acquired ISO 14001 certification (2005).
This company is recommended by the following support organizations.
- Kansai Head Office, SMRJ