最終更新日時： 2016/11/30 19:32:50
Yamato Electronic Co., Ltd.
We are a glass manufacturer expanding its business in Japan and overseas.
We mainly manufacture and sell glass frits used as sealing materials and glass molding articles made using special molding technology. We have a track record of deliveries in Japan to universities and research institutes, as well as major home electronics manufacturers. We have delivered encapsulants for organic EL to Korean enterprises. We handle embedding of glass, metal, and so on. We have also expanded our business by responding to various other needs. These include LED glass frit encapsulants, glass wafers for MEMS, three-dimensional (3D) glass bending processing technology, thermal transfer printing technology, and so on. We are hastening to strengthen our corporate system in view of advancing overseas expansion.
[Company strength] We have long experience in dealing with special molding technology for molding various shapes from flat glass, and we can achieve moldings in various shapes. Glass frit is a relatively new business for us. Only a dozen or so years have passed since we started the business, but we have succeeded in mass production ahead of existing manufacturers. We can support our customers’ mass production from small lots in the case of new development. [Business description] We manufacture and sell glass products. We mainly deal with glass frits used as sealing materials and glass molding articles made using special molding technology. We focus on trial manufacturing and mass production of glass frits and glass molding articles, but we also manufacture vacuum packages as needed. [Industry] Glass manufacturing [Strength of products/technologies] We develop and mass-produce glass as raw materials and finished products. This is why we can provide various parts and products without destroying the characteristics of the glass. Our original advantage is that we can process inorganic matter into totally different shapes, such as embedding glass and metal. We also possess technologies for LED glass frit encapsulants, glass wafers for MEMS, three-dimensional glass bending processing, and thermal transfer printing. [Representative's message] We have recently been trying out exhibiting our products at the annual CEATEC exhibition, which is the largest-scale exhibition of its kind in Japan. We are expanding our technology sales network. We hope to further refine our existing technology based on our corporate concept of pushing beyond the limits of glass. We also hope to expand the reach of our products that make use of our advanced sealing technology and special glass molding technology using glass frit. We are mainly targeting East Asia (Korea and China) and the USA. [Company structure for market development/overseas expansion] We have mainly provided sealing material and glass molding products as parts to domestic Japanese home electronics appliance manufacturers. It has become possible to expand the reach of these materials to a wide range of areas by supplying organic EL encapsulant to major overseas manufacturers. We have added more engineering staff members so we can make proposals about glass products to domestic Japanese and overseas manufacturers. These products make use of special glass processing with the molding technology we have been cultivating for many years. They include products with excellent design and special functions like glass wafer for MEMS sensors. We are expanding our business in the East Asia region (Korea, China, and Taiwan) mainly with our Korean affiliates. We actively began on-site surveys in the United States from last year. [Market share/Ranking] Our inorganic encapsulant for organic EL has a market share of more than 90% (in-company investigation). [Awards and media coverage] [Awards] Kagoshima Chamber of Commerce and Industry, Industrial Finance Prize, Incentive Award (December 1997); Kagoshima Chamber of Commerce and Industry, Industrial Finance Prize, Special Award (February 2001). [Media] [Joint research and development] Kagoshima University: Development of lead-free glass (since 2000) and encapsulant for organic EL (2012 to 2013 and 2014 to 2015). [Intellectual property] Registered patents: Manufacturing Method for Non-Lead Glass Material for Sealing Organic EL, Organic EL Display, and Manufacturing Method (Japanese Patent No. 5713993), and 13 other patents (including patents registered overseas). Pending patents: We have three patent applications under the PCT (one of these patents has already been transferred to five countries). [Main Clients / Business History (domestic)] Japanese companies: encapsulant for optical pick-up lenses, since 2003; image pick-up tubes, since 2005; glass for water meters, 2004 to 2012; glass wafers for MEMS sensors, since 2014; many other major manufacturers of home electronics appliances, various university laboratories (glass materials for organic EL), and so on. [Main Clients / Business History (overseas)] Korea (encapsulant for organic EL, since 2006)
- Kyushu Head Office, SMRJ