最終更新日時： 2022/06/28 13:48:37
KST World Corp.
We supply wafers with thick thermal oxide films of up to 30 μm in thickness.
We are a manufacturer specializing in film formation and deposition services, mainly of thermal oxide films on silicon wafers. We provide products to optical component manufacturers. We supply wafers with thick thermal oxide films of up to 30 μm in thickness with excellent surface cleanliness. Various manufacturers of optical components and communications equipment have adopted our products due to a wide range of size availability.
[Company strength] We offer film deposition services, mainly of thermal oxide films. We particularly boast of our unique processing techniques of thick thermal oxide films (up to 20 μm) and supply products to optical component manufacturers. We have also launched the production of SOI wafers for micro electro mechanical systems (MEMS) and power devices, and we possess techniques to manufacture cavity SOI wafers. We are capable of handling production in various quantities ranging from low-volume manufacturing for research and development to mass production. [Business description] Our core business is film formation and deposition services for silicon wafers. We conduct processing with our own facilities as a manufacturer specializing in film deposition processing. We also fully utilize our network and offer one-stop services, ranging from sale of silicon wafers to processing by our cooperating companies in response to customer requests. In addition, we have launched the production of silicon-on-insulator (SOI) wafers and are capable of delivering products in a short turnaround time. [Industry] Film formation and deposition services [Strength of products/technologies] We started our business in the Japanese market in February 1999 and started supplying wafers with thick thermal oxide films for manufacturers of optical components in May of the same year. Our wafers with thick thermal oxide films possess excellent surface cleanliness and stable film quality. We can handle film thickness of up to 30 μm and wafers of any size from 4 to 12 in. Our products play such a prominent role in the industry that they can determine production yields of optical devices that support optical communications. Therefore, they have been introduced as indispensable materials by manufacturers of optical components and telecommunications equipment all over the world. [Representative's message] We were established in 1998 as Japan's first manufacturer specializing in film formation and deposition services for silicon wafers. We respond to the diverse needs of our customers by following our basic concepts of “low price,” “short turnaround time,” and “high quality” and by creating films of different thickness ranging from common thin films to thick ones, which are our specialties. We aim to be the best business partner of our clients by fully utilizing our domestic and international networks fostered since our foundation, and by seeking collaboration from our cooperating companies for producing products that we cannot manufacture by ourselves. [Company structure for market development/overseas expansion] The Sales Departments at the Fukui Head Office and the Tokyo Sales Office handle sales and marketing related to our core business. English-speaking workers at the Tokyo Sales Office mainly attend to overseas clients. We can also communicate in Chinese via our affiliate in Taiwan. Technical consultations beyond the capacity of the Sales Departments are handled with help from workers at the Product Department who may visit clients, if necessary, for problem solving. The President guides all workers to ensure scrupulous services in handling customers. [Market share/Ranking] 80% share in global market of wafers with thick thermal oxide films used for optical components. [Awards and media coverage] [Awards] 300 of Japan's Vibrant Monozukuri (Manufacturing) SMEs (2006); Nikkan Kogyo Shimbun-sha Award of the Kansai Front Runner Grand Prize (2007); JAMBO Award Local Platform Grand Prix for New Business Creation (2007); Monozukuri (Manufacturing) Nippon Grand Award Excellence Prize (2007) [Media] “Chiisana Top Runner.” Nikkei Business, 12 May 2008; “Good Job.” the Asahi Shimbun, 8 Nov. 2012 [Authorization/Certification] ISO 9001 (December 1, 2005) [Joint research and development] “Development of Yb: YAG Microchip Devices Combined with Heat Sinks, 2004-2006” with the National Institute of Natural Sciences and others (a research and development project of the Japan Consortium for Area Studies) [Transaction form] Trial manufacturing and joint development, consignment manufacturing, and sale of products and materials. [Transaction terms] Subject to our terms and conditions along with mutual consultations. [Main Clients / Business History (domestic)] Major manufacturers of semiconductor devices and semiconductor materials among many others. [Main Clients / Business History (overseas)] Post-process semiconductor manufacturers in Taiwan and other countries. [Exhibition History/Information] SEMICON Japan 2010 and 2011; Micromachine MEMS 2010, 2011, and 2012; Nanomicro Biz 2013; Tokyo International Industry Exhibition 2013; SEMICON Taiwan 2012 and 2013; SEMICON Europe 2012 and 2013; SEMICON Japan 2014 (planned); SEMICON Taiwan 2014 (planned); SEMICON Europe 2014 (planned)
- Hokuriku Head Office, SMRJ